Technology Foundation

Our passion is to create technology that helps you achieve your MEMS vision.



The Power of Innovation

ePack's solutions are built on years of intellectual property developed at the University of Michigan at Ann Arbor. The University of Michigan is one of the few places in the world that has demonstrated reliable wafer-level vacuum packaging.

Vacuum Encapsulation

Wafer level packaging provides moisture and particulate protection while also being cost effective and scalable . In addition, ePack's technology provides a vacuum environment, which is important for gyroscopes and other MEMS devices.

Wafer Level Packaging

Chip-level packaging involves older semiconductor fabrication technology and suffers from high manufacturing costs and decreased reliability. Batch level packaging is cheaper and higher performing.

Packaging Matters

Packaging is the doorway to commercialization for a host of exciting, fast growing micro-scale devices, and ePack is the company that is going to help open that door.