ePack's Packaging Solutions

SOLUTIONS

ePack's solutions are developed specifically for your application. Let ePack help you bring your products to market faster with superior packaging technology.


 

FT
WLMSHybrid

ePack can provide an electrical connection to your
MEMS device in three ways:

- Vertical feed-through interconnects
- Lateral feed-through interconnects
- Wireless telemetry, sensing and power

ePack is the world expert in wafer level vacuum/
hermetic packaging of MEMS devices:

- Au-Si eutectic & solder bonding
- Anodic & glass frit bonding
- Polymers & biomedical
- Multi-stack process integration

ePack's isolation MEMS technology is designed to
protect MEMS devices from temperature fluctuations, vibration and mechanical shock. This technology has been developed specifically for high-performance MEMS applications.

KEY FEATURES

KEY FEATURESKEY FEATURES
- Integration into almost any process
- Cap and device wafer feed-throughs
- Wide range of materials; Poly-Si, metals, solder
and bulk SI
- Wireless interconnection

- Small size: 1000s of devices/wafer
- Low unit prices
- Vacuum pressure ranges of 1mTorr to 760 Torr
- Proven reliability
- Lead free
- Temperature stability of ±0.5C at <50mW for
ambient temperatures from -40C to 80C
- Filters out vibration > 1kHz
- High performance shock protection
MEMS APPLICATIONS
MEMS APPLICATIONSMEMS APPLICATIONS
- All MEMS applications
- Gyroscopes and accelerometers
- Resonators and switches
- Bolometers and thermopiles
- Pressure sensors and microphones
- Navigation grade gyroscopes
- Oven controlled oscillators